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3844d761ee
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(module R_0805_HandSolder_Short (layer F.Cu) (tedit 5CC1C003) |
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(descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator") |
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(tags "resistor handsolder") |
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(attr smd) |
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(fp_text reference REF** (at 0 -1.65) (layer F.SilkS) |
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(effects (font (size 1 1) (thickness 0.15))) |
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) |
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(fp_text value R_0805_HandSolder_Short (at 0 1.65) (layer F.Fab) |
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(effects (font (size 1 1) (thickness 0.15))) |
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) |
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(fp_line (start -1 0.6) (end -1 -0.6) (layer F.Fab) (width 0.1)) |
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(fp_line (start -1 -0.6) (end 1 -0.6) (layer F.Fab) (width 0.1)) |
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(fp_line (start 1 -0.6) (end 1 0.6) (layer F.Fab) (width 0.1)) |
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(fp_line (start 1 0.6) (end -1 0.6) (layer F.Fab) (width 0.1)) |
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(fp_line (start -0.261252 -0.71) (end 0.261252 -0.71) (layer F.SilkS) (width 0.12)) |
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(fp_line (start -0.261252 0.71) (end 0.261252 0.71) (layer F.SilkS) (width 0.12)) |
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(fp_line (start -1.85 0.95) (end -1.85 -0.95) (layer F.CrtYd) (width 0.05)) |
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(fp_line (start -1.85 -0.95) (end 1.85 -0.95) (layer F.CrtYd) (width 0.05)) |
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(fp_line (start 1.85 -0.95) (end 1.85 0.95) (layer F.CrtYd) (width 0.05)) |
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(fp_line (start 1.85 0.95) (end -1.85 0.95) (layer F.CrtYd) (width 0.05)) |
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(fp_text user %R (at 0 0) (layer F.Fab) |
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(effects (font (size 0.5 0.5) (thickness 0.08))) |
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) |
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(fp_poly (pts (xy -0.6 -0.15) (xy 0.6 -0.15) (xy 0.6 0.15) (xy -0.6 0.15)) (layer F.Cu) (width 0)) |
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(pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)) |
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(pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)) |
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(model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl |
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(at (xyz 0 0 0)) |
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(scale (xyz 1 1 1)) |
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(rotate (xyz 0 0 0)) |
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) |
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) |
@ -0,0 +1,51 @@ |
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(module TI_SO-PowerPAD-8_ThermalVias (layer F.Cu) (tedit 5CC1BCA3) |
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(descr "8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf") |
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(tags "HTSOP 1.27") |
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(attr smd) |
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(fp_text reference REF** (at 0 -3.5) (layer F.SilkS) |
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(effects (font (size 1 1) (thickness 0.15))) |
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) |
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(fp_text value TI_SO-PowerPAD-8_ThermalVias (at 0 3.5) (layer F.Fab) |
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(effects (font (size 1 1) (thickness 0.15))) |
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) |
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(fp_line (start -2.075 -2.525) (end -3.475 -2.525) (layer F.SilkS) (width 0.15)) |
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(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15)) |
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(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15)) |
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(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15)) |
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(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15)) |
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(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15)) |
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(fp_line (start -2.075 -2.575) (end -2.075 -2.525) (layer F.SilkS) (width 0.15)) |
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(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05)) |
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(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05)) |
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(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05)) |
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(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05)) |
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(fp_line (start -1.95 -1.45) (end -0.95 -2.45) (layer F.Fab) (width 0.15)) |
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(fp_line (start -1.95 2.45) (end -1.95 -1.45) (layer F.Fab) (width 0.15)) |
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(fp_line (start 1.95 2.45) (end -1.95 2.45) (layer F.Fab) (width 0.15)) |
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(fp_line (start 1.95 -2.45) (end 1.95 2.45) (layer F.Fab) (width 0.15)) |
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(fp_line (start -0.95 -2.45) (end 1.95 -2.45) (layer F.Fab) (width 0.15)) |
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(fp_text user %R (at 0 0) (layer F.Fab) |
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(effects (font (size 0.9 0.9) (thickness 0.135))) |
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) |
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(fp_arc (start 0 -2.6) (end -0.6 -2.5) (angle -163.412603) (layer F.SilkS) (width 0.2)) |
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(pad 9 thru_hole circle (at -0.6 -0.6) (size 1.2 1.2) (drill 0.8) (layers *.Cu)) |
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(pad 9 smd rect (at 0 0) (size 2.95 4.5) (layers B.Cu)) |
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(pad 8 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)) |
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(pad 7 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)) |
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(pad 6 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)) |
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(pad 5 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)) |
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(pad 4 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)) |
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(pad 3 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)) |
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(pad 2 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)) |
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(pad 1 smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)) |
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(pad 9 smd rect (at 0 0) (size 2.95 4.5) (layers F.Cu)) |
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(pad 9 smd rect (at 0 0) (size 2.6 3.1) (layers *.Mask F.Cu F.Paste)) |
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(pad 9 thru_hole circle (at 0.6 -0.6) (size 1.2 1.2) (drill 0.8) (layers *.Cu)) |
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(pad 9 thru_hole circle (at -0.6 0.6) (size 1.2 1.2) (drill 0.8) (layers *.Cu)) |
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(pad 9 thru_hole circle (at 0.6 0.6) (size 1.2 1.2) (drill 0.8) (layers *.Cu)) |
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(model ${KISYS3DMOD}/Package_SO.3dshapes/HTSOP-8-1EP_3.9x4.9mm_Pitch1.27mm.wrl |
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(at (xyz 0 0 0)) |
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(scale (xyz 1 1 1)) |
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(rotate (xyz 0 0 0)) |
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) |
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) |
Loading…
Reference in new issue