From 2e60424e33aa5d97fe789a41ac27752d7b1d59f0 Mon Sep 17 00:00:00 2001 From: =?UTF-8?q?Ond=C5=99ej=20Hru=C5=A1ka?= Date: Thu, 25 Apr 2019 17:11:51 +0200 Subject: [PATCH] add R0805-short, fixed TI-SO8 with vias, new symbols (ULN2008S from digikey, fixed pin config) --- Hruska.dcm | 6 + Hruska.lib | 124 +++++++++++++++++- .../R_0805_HandSolder_Short.kicad_mod | 32 +++++ .../TI_SO-PowerPAD-8_ThermalVias.kicad_mod | 51 +++++++ 4 files changed, 212 insertions(+), 1 deletion(-) create mode 100644 Hruska.pretty/R_0805_HandSolder_Short.kicad_mod create mode 100644 Hruska.pretty/TI_SO-PowerPAD-8_ThermalVias.kicad_mod diff --git a/Hruska.dcm b/Hruska.dcm index 848bba8..8cb7300 100644 --- a/Hruska.dcm +++ b/Hruska.dcm @@ -36,4 +36,10 @@ K SM712CT-ND F https://www.semtech.com/uploads/documents/sm712.pdf $ENDCMP # +$CMP ULN2003ADR +D IC PWR RELAY 7NPN 1:1 16SOIC +K 296-1368-1-ND +F http://www.ti.com/lit/ds/symlink/uln2003a.pdf +$ENDCMP +# #End Doc Library diff --git a/Hruska.lib b/Hruska.lib index 98218b4..6f8934a 100644 --- a/Hruska.lib +++ b/Hruska.lib @@ -288,7 +288,7 @@ X 14 5 -550 100 100 R 50 50 1 1 P X 12 6 -550 0 100 R 50 50 1 1 P X 13 7 -550 -100 100 R 50 50 1 1 P X 5V_IN 8 -550 -200 100 R 50 50 1 1 W -X Vbat_IN 9 -550 -300 100 R 50 50 1 1 w +X Vbat_IN 9 -550 -300 100 R 50 50 1 1 W ENDDRAW ENDDEF # @@ -703,6 +703,128 @@ X REF 3 -150 0 125 R 50 50 1 1 P ENDDRAW ENDDEF # +# ULN2003ADR +# +DEF ULN2003ADR Q 0 1 Y Y 1 F N +F0 "Q" -455 540 60 H V C CNN +F1 "ULN2003ADR" 27 -540 60 H V L CNN +F2 "digikey-footprints:SOIC-16_W3.90mm" 900 250 60 H I L CNN +F3 "http://www.ti.com/lit/ds/symlink/uln2003a.pdf" 900 350 60 H I L CNN +F4 "296-1368-1-ND" 900 450 60 H I L CNN "Digi-Key_PN" +F5 "ULN2003ADR" 200 500 60 H I L CNN "MPN" +F6 "Discrete Semiconductor Products" 900 650 60 H I L CNN "Category" +F7 "Transistors - Bipolar (BJT) - Arrays" 900 750 60 H I L CNN "Family" +F8 "http://www.ti.com/lit/ds/symlink/uln2003a.pdf" 900 850 60 H I L CNN "DK_Datasheet_Link" +F9 "/product-detail/en/texas-instruments/ULN2003ADR/296-1368-1-ND/404968" 900 950 60 H I L CNN "DK_Detail_Page" +F10 "IC PWR RELAY 7NPN 1:1 16SOIC" 900 1050 60 H I L CNN "Description" +F11 "Texas Instruments" 900 1150 60 H I L CNN "Manufacturer" +F12 "Active" 200 1200 60 H I L CNN "Status" +DRAW +C -140 -300 10 1 1 0 N +C -140 -100 10 1 1 0 N +C -140 100 10 1 1 0 N +C -140 300 10 1 1 0 N +C -70 -300 10 1 1 0 F +C -70 -100 10 1 1 0 F +C -70 100 10 1 1 0 F +C -70 300 10 1 1 0 F +C -65 -200 10 1 1 0 N +C -65 0 10 1 1 0 N +C -65 200 10 1 1 0 N +C 125 -250 10 1 1 0 F +C 125 -150 10 1 1 0 F +C 125 -50 10 1 1 0 F +C 125 50 10 1 1 0 F +C 125 150 10 1 1 0 F +C 125 250 10 1 1 0 F +C 125 350 10 1 1 0 F +S -500 500 500 -500 1 1 0 f +P 2 0 1 0 -300 -300 -330 -300 N +P 2 0 1 0 -300 -200 -330 -200 N +P 2 0 1 0 -300 -100 -330 -100 N +P 2 0 1 0 -300 100 -330 100 N +P 2 0 1 0 -300 200 -330 200 N +P 2 0 1 0 -300 300 -330 300 N +P 2 0 1 0 -290 0 -330 0 N +P 2 0 1 0 200 -200 270 -200 N +P 2 0 1 0 200 -100 270 -100 N +P 2 0 1 0 200 0 270 0 N +P 2 0 1 0 200 100 270 100 N +P 2 0 1 0 200 200 270 200 N +P 2 0 1 0 200 300 270 300 N +P 2 0 1 0 200 400 300 400 N +P 2 0 1 0 210 -300 270 -300 N +P 2 0 1 0 300 400 340 400 N +P 2 1 1 0 -300 -200 -175 -200 N +P 2 1 1 0 -300 200 -175 200 N +P 2 1 1 0 -295 0 -175 0 N +P 2 1 1 0 -250 -300 -300 -300 N +P 2 1 1 0 -250 -100 -300 -100 N +P 2 1 1 0 -250 100 -300 100 N +P 2 1 1 0 -250 300 -300 300 N +P 2 1 1 0 -130 -300 210 -300 N +P 2 1 1 0 -130 -100 200 -100 N +P 2 1 1 0 -130 100 200 100 N +P 2 1 1 0 -130 300 -120 300 N +P 2 1 1 0 -120 300 200 300 N +P 2 1 1 0 -55 -200 200 -200 N +P 2 1 1 0 -55 0 200 0 N +P 2 1 1 0 -55 200 200 200 N +P 2 1 1 0 50 -225 50 -275 N +P 2 1 1 0 50 -150 125 -150 N +P 2 1 1 0 50 -125 50 -175 N +P 2 1 1 0 50 -50 125 -50 N +P 2 1 1 0 50 -25 50 -75 N +P 2 1 1 0 50 50 125 50 N +P 2 1 1 0 50 75 50 25 N +P 2 1 1 0 50 150 125 150 N +P 2 1 1 0 50 175 50 125 N +P 2 1 1 0 50 250 125 250 N +P 2 1 1 0 50 275 50 225 N +P 2 1 1 0 50 350 125 350 N +P 2 1 1 0 50 375 50 325 N +P 2 1 1 0 125 -250 50 -250 N +P 3 1 1 0 -70 -300 -70 -250 0 -250 N +P 3 1 1 0 -70 -100 -70 -50 0 -50 N +P 3 1 1 0 -70 100 -70 150 0 150 N +P 3 1 1 0 -65 -190 -65 -150 0 -150 N +P 3 1 1 0 -65 10 -65 50 5 50 N +P 3 1 1 0 -65 210 -65 250 5 250 N +P 3 1 1 0 0 350 -70 350 -70 300 N +P 3 1 1 0 125 -250 125 400 200 400 N +P 4 1 1 0 -250 -250 -250 -350 -150 -300 -250 -250 N +P 4 1 1 0 -250 -50 -250 -150 -150 -100 -250 -50 N +P 4 1 1 0 -250 150 -250 50 -150 100 -250 150 N +P 4 1 1 0 -250 350 -250 250 -150 300 -250 350 N +P 4 1 1 0 -175 -150 -175 -250 -75 -200 -175 -150 N +P 4 1 1 0 -175 50 -175 -50 -75 0 -175 50 N +P 4 1 1 0 -175 250 -175 150 -75 200 -175 250 N +P 4 1 1 0 0 -225 0 -275 50 -250 0 -225 F +P 4 1 1 0 0 -125 0 -175 50 -150 0 -125 F +P 4 1 1 0 0 -25 0 -75 50 -50 0 -25 F +P 4 1 1 0 0 75 0 25 50 50 0 75 F +P 4 1 1 0 0 175 0 125 50 150 0 175 F +P 4 1 1 0 0 275 0 225 50 250 0 275 F +P 4 1 1 0 0 375 0 325 50 350 0 375 F +X IN_1 1 -600 300 100 R 50 50 1 1 I +X OUT_7 10 600 -300 100 L 50 50 1 1 P +X OUT_6 11 600 -200 100 L 50 50 1 1 P +X OUT_5 12 600 -100 100 L 50 50 1 1 P +X OUT_4 13 600 0 100 L 50 50 1 1 P +X OUT_3 14 600 100 100 L 50 50 1 1 P +X OUT_2 15 600 200 100 L 50 50 1 1 P +X OUT_1 16 600 300 100 L 50 50 1 1 P +X IN_2 2 -600 200 100 R 50 50 1 1 I +X IN_3 3 -600 100 100 R 50 50 1 1 I +X IN_4 4 -600 0 100 R 50 50 1 1 I +X IN_5 5 -600 -100 100 R 50 50 1 1 I +X IN_6 6 -600 -200 100 R 50 50 1 1 I +X IN_7 7 -600 -300 100 R 50 50 1 1 I +X GND 8 0 -600 100 U 50 50 1 1 W +X COM 9 600 400 100 L 50 50 1 1 P +ENDDRAW +ENDDEF +# # USBLC6-2SC6 # DEF USBLC6-2SC6 U 0 40 Y Y 1 F N diff --git a/Hruska.pretty/R_0805_HandSolder_Short.kicad_mod b/Hruska.pretty/R_0805_HandSolder_Short.kicad_mod new file mode 100644 index 0000000..f6adbf9 --- /dev/null +++ b/Hruska.pretty/R_0805_HandSolder_Short.kicad_mod @@ -0,0 +1,32 @@ +(module R_0805_HandSolder_Short (layer F.Cu) (tedit 5CC1C003) + (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator") + (tags "resistor handsolder") + (attr smd) + (fp_text reference REF** (at 0 -1.65) (layer F.SilkS) + (effects (font (size 1 1) (thickness 0.15))) + ) + (fp_text value R_0805_HandSolder_Short (at 0 1.65) (layer F.Fab) + (effects (font (size 1 1) (thickness 0.15))) + ) + (fp_line (start -1 0.6) (end -1 -0.6) (layer F.Fab) (width 0.1)) + (fp_line (start -1 -0.6) (end 1 -0.6) (layer F.Fab) (width 0.1)) + (fp_line (start 1 -0.6) (end 1 0.6) (layer F.Fab) (width 0.1)) + (fp_line (start 1 0.6) (end -1 0.6) (layer F.Fab) (width 0.1)) + (fp_line (start -0.261252 -0.71) (end 0.261252 -0.71) (layer F.SilkS) (width 0.12)) + (fp_line (start -0.261252 0.71) (end 0.261252 0.71) (layer F.SilkS) (width 0.12)) + (fp_line (start -1.85 0.95) (end -1.85 -0.95) (layer F.CrtYd) (width 0.05)) + (fp_line (start -1.85 -0.95) (end 1.85 -0.95) (layer F.CrtYd) (width 0.05)) + (fp_line (start 1.85 -0.95) (end 1.85 0.95) (layer F.CrtYd) (width 0.05)) + (fp_line (start 1.85 0.95) (end -1.85 0.95) (layer F.CrtYd) (width 0.05)) + (fp_text user %R (at 0 0) (layer F.Fab) + (effects (font (size 0.5 0.5) (thickness 0.08))) + ) + (fp_poly (pts (xy -0.6 -0.15) (xy 0.6 -0.15) (xy 0.6 0.15) (xy -0.6 0.15)) (layer F.Cu) (width 0)) + (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)) + (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)) + (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl + (at (xyz 0 0 0)) + (scale (xyz 1 1 1)) + (rotate (xyz 0 0 0)) + ) +) diff --git a/Hruska.pretty/TI_SO-PowerPAD-8_ThermalVias.kicad_mod b/Hruska.pretty/TI_SO-PowerPAD-8_ThermalVias.kicad_mod new file mode 100644 index 0000000..6f1c7da --- /dev/null +++ b/Hruska.pretty/TI_SO-PowerPAD-8_ThermalVias.kicad_mod @@ -0,0 +1,51 @@ +(module TI_SO-PowerPAD-8_ThermalVias (layer F.Cu) (tedit 5CC1BCA3) + (descr "8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf") + (tags "HTSOP 1.27") + (attr smd) + (fp_text reference REF** (at 0 -3.5) (layer F.SilkS) + (effects (font (size 1 1) (thickness 0.15))) + ) + (fp_text value TI_SO-PowerPAD-8_ThermalVias (at 0 3.5) (layer F.Fab) + (effects (font (size 1 1) (thickness 0.15))) + ) + (fp_line (start -2.075 -2.525) (end -3.475 -2.525) (layer F.SilkS) (width 0.15)) + (fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15)) + (fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15)) + (fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15)) + (fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15)) + (fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15)) + (fp_line (start -2.075 -2.575) (end -2.075 -2.525) (layer F.SilkS) (width 0.15)) + (fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05)) + (fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05)) + (fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05)) + (fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05)) + (fp_line (start -1.95 -1.45) (end -0.95 -2.45) (layer F.Fab) (width 0.15)) + (fp_line (start -1.95 2.45) (end -1.95 -1.45) (layer F.Fab) (width 0.15)) + (fp_line (start 1.95 2.45) (end -1.95 2.45) (layer F.Fab) (width 0.15)) + (fp_line (start 1.95 -2.45) (end 1.95 2.45) (layer F.Fab) (width 0.15)) + (fp_line (start -0.95 -2.45) (end 1.95 -2.45) (layer F.Fab) (width 0.15)) + (fp_text user %R (at 0 0) (layer F.Fab) + (effects (font (size 0.9 0.9) (thickness 0.135))) + ) + (fp_arc (start 0 -2.6) (end -0.6 -2.5) (angle -163.412603) (layer F.SilkS) (width 0.2)) + (pad 9 thru_hole circle (at -0.6 -0.6) (size 1.2 1.2) (drill 0.8) (layers *.Cu)) + (pad 9 smd rect (at 0 0) (size 2.95 4.5) (layers B.Cu)) + (pad 8 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)) + (pad 7 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)) + (pad 6 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)) + (pad 5 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)) + (pad 4 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)) + (pad 3 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)) + (pad 2 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)) + (pad 1 smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)) + (pad 9 smd rect (at 0 0) (size 2.95 4.5) (layers F.Cu)) + (pad 9 smd rect (at 0 0) (size 2.6 3.1) (layers *.Mask F.Cu F.Paste)) + (pad 9 thru_hole circle (at 0.6 -0.6) (size 1.2 1.2) (drill 0.8) (layers *.Cu)) + (pad 9 thru_hole circle (at -0.6 0.6) (size 1.2 1.2) (drill 0.8) (layers *.Cu)) + (pad 9 thru_hole circle (at 0.6 0.6) (size 1.2 1.2) (drill 0.8) (layers *.Cu)) + (model ${KISYS3DMOD}/Package_SO.3dshapes/HTSOP-8-1EP_3.9x4.9mm_Pitch1.27mm.wrl + (at (xyz 0 0 0)) + (scale (xyz 1 1 1)) + (rotate (xyz 0 0 0)) + ) +)