(footprint "TestPoint_Pad_2x_5.0x3.0mm_Edge_Flipped" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 623514CB)
  (descr "SMD rectangular pad as test Point, square 4.0mm side length")
  (tags "test point SMD pad rectangle square")
  (attr exclude_from_pos_files exclude_from_bom)
  (fp_text reference "REF**" (at -3.81 0.254 270) (layer "F.SilkS")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp f2cfc46f-56cc-4635-a309-77c2957034f7)
  )
  (fp_text value "TestPoint_Pad_2x_5.0x3.0mm_Edge_Flipped" (at 0.762 -3.048) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 36f89261-74d4-4f2d-b5b3-9cd1760a8ef5)
  )
  (fp_text user "${REFERENCE}" (at -3.81 0.254 270) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 4e59c1b2-73fa-4dbf-bf3c-d5cef1333eca)
  )
  (fp_line (start -2.667 -1.778) (end -2.667 11.938) (layer "F.SilkS") (width 0.15) (tstamp 49b02e6f-696e-430b-8d9e-e8afeb9b0afb))
  (fp_line (start 2.413 -1.778) (end -2.667 -1.778) (layer "F.SilkS") (width 0.15) (tstamp 537b32ea-4bbe-4fa3-94b0-3bb9ff2185e5))
  (fp_line (start -2.667 11.938) (end 2.286 11.938) (layer "F.SilkS") (width 0.15) (tstamp c44034cf-c892-4783-8fa4-88851e408cd3))
  (fp_rect (start 2.667 -1.778) (end -2.794 11.938) (layer "F.CrtYd") (width 0.12) (fill none) (tstamp 06b0f59d-5955-4cff-a86d-1a17e2ebba6e))
  (pad "1" smd roundrect (at 0 0 90) (size 3 5) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.5)
    (chamfer_ratio 0) (chamfer top_left top_right) (tstamp 43827c83-1685-422b-a4da-6da706d0d8fe))
  (pad "2" smd roundrect (at 0 10.16 90) (size 3 5) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.5)
    (chamfer_ratio 0) (chamfer top_left top_right) (tstamp 95ca36bc-2e45-4dc3-91c7-efa7ec6ec218))
)